|
Output Considerations
Bandwidth
Specification of Output Ripple
Hybrid DC/DC
Converters typically produce a complex output ripple spectrum that
extends to 50 MHz or even to 500 MHz. The ripple voltage has two
basic aspects. The first is differential voltage, and is the primary
component of the lower frequency ripple. The second component is
the common mode voltages generated from common mode currents. This
component predominates above 2 MHz and is seen on the oscilloscope
in the form of spikes.
Noise on converter
output leads can also be specified and controlled by EMI specifications
and techniques. However, in practice this proves cumbersome because
the time domain characteristics are usually more pertinent and easier
to visualize than the frequency domain characteristics.
This is why
output ripple, noise and spikes are usually specified in terms of
peak to peak voltage over a specified bandwidth. In actual practice,
reliance on this type of specification can be misleading in several
ways. One way is to limit the measurement bandwidth to 1 MHz or
2 MHz while the predominant spike content exceeds this. Virtually
all manufacturers of hybrid DC/DC Converters specify output ripple
with a 2 MHz bandwidth.
This encompasses
the fundamental ripple frequency and several of its harmonics for
most units sold today. This excludes the higher frequency, and often
higher amplitude, noise content.
A second measurement
technique is to make the measurements differentially. Since many
hybrid DC/DC Converters are designed with a low ESR output chip
capacitor straddling the output pins, differential measurements
can produce good test results. When the units are used in a system,
the noise output is inexplicably higher, but the difference is due
to common mode noise.
The most useful
method is to retain the voltage measurement over a meaningful bandwidth
but measure it so as to include the output common mode noise since
most higher frequency output ripple, noise and spikes are originated
as common mode signals.
What is the
significance of the distinction between the differential and common
mode outputs? The differential ripple and noise can be relatively
easy to filter either internally or externally. Common mode noise
is relatively more difficult to filter and thus tends to proliferate
throughout a system.

Common mode
noise is caused by internal EMI currents that flow out through output
lines seeking a return path back to the noise source. The best way
of suppressing common mode noise is by using common mode filtering
at the point closest to the noise source. The ideal location for
this common mode filtering is within the hybrid converter itself.
Older generation
hybrid DC/DC Converters have very simple filtering systems, often
consisting of no more than output capacitors. These types of converters
are usually very noisy at frequencies above 2 MHz, particularly
in terms of common mode noise.
The latest generation
of hybrid DC/DC Converter parts incorporate two advances that dramatically
lower output ripple and spikes when compared to earlier generation
DC/DC Converters. The first advance is the incorporation of output
common mode filter chokes directly within the DC/DC Converter package.
The second advance is the incorporation of high capacitance, low
ESR ceramic multilayer capacitors in the output stage. These capacitors,
which replace solid tantalum types common to older generation DC/DC
Converters, provide 1 to 2 decades of improved filtering at high
frequency when compared to solid tantalum filters.
Although these
noise reduction techniques are not in themselves novel, they represent
a radical improvement in performance when they are contained within
the shielded enclosure of the hybrid DC/DC Converter.
The result of
these two significant technology advances is dramatically reduced
output ripple and noise.
Figure 4 shows
the functional block diagram of a typical DC/DC Converter hybrid,
with integral input and output noise filtering. As this diagram
shows, it requires a substantial number of LC elements to control
hybrid DC/DC Converter noise. However, by tailoring the elements
precisely to the noise spectrum, the small sizes needed to fit within
the hybrid converter package may be realized.

On the power
input side, the common mode currents are interrupted by a high inductance
common mode choke or balun. A shunt capacitor connected to the hybrid
case allows the common mode input currents to be localized, instead
of flowing out to the input leads. Two stages of LC differential
filtering are used to reduce ripple current levels. By using two
cascaded higher frequency stages, each stage is physically smaller
than a larger, lower frequency single stage.
On the output
side, it can be seen again that there is no substitute for filter
elements. A common mode choke and shunt capacitor to case completely
tame the common mode spikes. A small differential filter adds the
final bit of filtering to the output leads. At above approximately
10 MHz, the output filters within the hybrid can become capacitive.
To have these high frequency spikes, external ferrite leads and
small capacitors may be used to tame the residual spikes.
In some applications
(such as cameras, low noise amplifiers, etc.) it is desirable to
attain additional differential filtering. Surface mount ceramic
capacitors make the best filters when wired as shown in the figure
(as a four terminal capacitor).
While other
filter circuit topologies are possible, this type of filter arrangement
has proved to be highly useful in production applications requiring
good suppression of converter noise.
It is important
to note that although the outputs of the hybrid DC/DC Converter
are highly filtered, the outputs will normally exceed MIL-STD-461
levels. Also, connecting the case to the output leads bypasses the
internal common mode filter and may result in the input exceeding
EMI levels or the output spikes increasing. If the case must be
connected to output ground for any reason, it is helpful to use
a high value resistor (a value of 10K to 100K should be considered).
However, the
case may be connected to RF or chassis ground to enhance EMI filtering.
|