Test
Procedure |
MIL-STD-883
Method |
MIL-STD-883
Condition |
Detail
Requirements |
MDI
Screening |
Nondestruct
Bond Pull |
2023 |
— |
100% Wires
2% PDA |
Same |
| Internal Visual |
2017 |
— |
— |
Same |
| Temperature Cycling |
1010 |
B |
-55°C to +125°C
10 Cycles |
Same |
| Mechanical Shock or Constant Acceleration |
2002 and
2001 |
B1 Y1 Only
A1 Y1 Only |
1500Gs
5000 Gs |
Constant Acceleration
500 Gs standard1 |
| Pind |
2020 |
B |
10 Gs, 60 HZ |
Same |
| Electrical Test |
— |
— |
Functional Test |
Same |
| Burn-in (85°C) |
1015 |
— |
N/A
(Maximum applied voltage and current) |
85°C Tcase 320 hrs
(Nominal input voltage and 100% rated load) |
| Final Electrical Test |
— |
— |
MDI ATP
PDA = 2% or 1 device |
Same
-55°C, 25°C, 85°C testing with data |
| Fine Leak |
1014 |
A1 or A2 |
Dependent on Vacant Interior Cavity of Hybrid |
Same |
| Gross Leak |
1014 |
C1 |
— |
Same |
| Radiography |
2012 |
— |
Y Direction |
Same |
| External Visual |
2009 |
— |
— |
Same |
Note 1 — Higher acceleration test levels available: Consult factory. |
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Page Revised 06/13/2006 |