Hybrids combined with discrete components allow great volumetric efficiency as compared to all discrete designs. MDI's packaging technology incorporates the latest advances in NC milled and dip brazed enclosures, printed wiring and surface mount technology.

This product capability provides:
• Higher packaging densities than all discrete designs
• Lower cost and quicker delivery than all hybrid designs
• Best suited for aerospace/high reliability, high density requirements at power levels from 50 watts to 1 KVA