Derating Analysis

The thermal analysis and electrical stress analysis feed into the derating analysis. Overall specifications, such as MIL-STD-975 and related specifications, impose derating limits for piece part application, many being temperature dependent. The derating analysis is usually in tabular form, comparing each piece part’s rating with its stress level. Often a customer will only explicitly need the derating analysis, however, the SPICE Model, electrical stress and thermal analysis are all required for a meaningful input.

A worse case analysis may take the SPICE Model and vary the tolerances of the various components in a random way. This is also called Monte Carlo analysis. Or, the drift of component tolerances may be assessed for an End of Life analysis. This type of analysis predicts how the power supply will operate at the end of a long duration, for example a 30 year Space Station application.


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Thermal Analysis MTBF Analysis

Page Added 09/30/2006